Traduction de «Circuit intégré à haute densité » (Français → Anglais) :

high density integrated circuit

high density multilayer circuits

large-scale integrated circuit [ large scale integrated circuit | LSI circuit | chip circuit | multiple-function chip ]

MSI circuit [ medium scale integrated circuit | medium-scale integrated circuit ]

high-complexity integrated circuit

double-sided high-density diskette | DSHD diskette | double sided high density diskette

application-specific integrated circuit | ASIC

very high scale integrated circuit [ VHSIC ]

Application Specific Integrated circuit | ASIC

Lead in solder to attach heat spreaders to the heat sink in power semiconductor assemblies with a chip size of at least 1 cm2 of projection area and a nominal current density of at least 1 A/mm2 of silicon chip area

calls, therefore, on the Commission, in view of the likely failure of the market to supply rural, insular and mountainous areas with NGA networks, to incorporate new organisational models, providing in particular for the involvement of local authorities, such as citizens’ networks and publicly run networks or those acquired using public funds, for the provision and financing of high-speed and ultra-high-speed networks as an option into the Community Guidelines for the application of State aid rules in relation to rapid deployment of broadband networks in order to make broadband functions accessible to all Europeans and ensure that urban ...[+++]and rural areas will be treated equally and coverage can extend to sparsely populated areas and to guarantee the same standards as regards quality, access, and pricing;

– Nano-electronics, photonics and integrated micro/nano-systems: process, device and design technologies to improve size, density, performance, energy efficiency, manufacturing and cost-effectiveness for components, systems-on-a-chip, systems-in-a-package and integrated systems; basic photonic components for wide range of applications; high-performance/high-density data storage systems; very large area/highly integrated display solutions; sensing, actuating, vision and imaging devices; ultra low power systems, alternative energy sources/storage; heterogeneous technologies/systems integration; multi-functional integrated micro-nano ...[+++]-bio-info systems; large-area electronics; integration in different materials/objects; interfacing with living organisms; (self-)assembly of molecules or atoms into stable structures.

– Nano-electronics, photonics and integrated micro/nano-systems: process, device, design and testing technologies and methodologies to improve size, density, performance, energy efficiency, manufacturing and cost-effectiveness of components, systems-on-a-chip, systems-in-a-package and integrated systems; advanced wireless components and sub-systems; basic photonic components to generate, manipulate and detect light for a wide range of applications including ultra fast components ; RF systems; high-performance/high-density data storage systems; very large area and/or highly integrated flexible display solutions; sensing, actuating, ...[+++]vision and imaging devices; ultra low power systems, alternative energy sources/storage; heterogeneous technologies/systems integration; smart systems; multi-functional integrated micro-nano-bio-info systems; large-area electronics; integration in different materials/objects; interfacing with living organisms; (self-)assembly of molecules or atoms into stable structures.