Translation of "Composant intégré " (French → English) :

All companies will profit from the provision that there will be no need, as a general rule, to obtain a licence for transfers of sub-systems or components that are integrated into armaments systems and cannot be transferred or exported at a later stage.

(d) The integration of components into a product does not automatically guarantee that such a component cannot be transferred as such in a later stage Therefore, the Member States should refrain from imposing any export limitations only if the recipient of transfers declares that the sub-systems or components subject to a transfer licence are integrated into its own products in such a way that prevents them to be transferred or even exported to a third country at a later stage as such (Amendments to article 4, paragraph 6).

– Nano-electronics, photonics and integrated micro/nano-systems: process, device, design and testing technologies and methodologies to improve size, density, performance, energy efficiency, manufacturing and cost-effectiveness of components, systems-on-a-chip, systems-in-a-package and integrated systems; advanced wireless components and sub-systems; basic photonic components to generate, manipulate and detect light for a wide range of applications including ultra fast components ; RF systems; high-performance/high-density data storage systems; very large area and/or highly integrated flexible display solutions; sensing, actuating, ...[+++]vision and imaging devices; ultra low power systems, alternative energy sources/storage; heterogeneous technologies/systems integration; smart systems; multi-functional integrated micro-nano-bio-info systems; large-area electronics; integration in different materials/objects; interfacing with living organisms; (self-)assembly of molecules or atoms into stable structures.

– Nano-electronics, photonics and integrated micro/nano-systems: process, device, design and testing technologies and methodologies to improve size, density, performance, energy efficiency, manufacturing and cost-effectiveness of components, systems-on-a-chip, systems-in-a-package and integrated systems; advanced wireless components and sub-systems; basic photonic components to generate, manipulate and detect light for wide range of applications including ultra fast components; RF systems; high-performance/high-density data storage systems; very large area and/or highly integrated flexible display solutions; sensing, actuating, vis ...[+++]ion and imaging devices; ultra low power systems, alternative energy sources/storage; heterogeneous technologies/systems integration; smart systems; multi-functional integrated micro-nano-bio-info systems; large-area electronics; integration in different materials/objects; interfacing with living organisms; (self-)assembly of molecules or atoms into stable structures.

The investigation has shown that the degree of overlap resulting form the merger is limited, in so far as individual components of brake systems or brake sub-systems are concerned: while the existing joint venture are established as suppliers of mechanical components for brake systems, Bosch's activities concentrate more on electronic skid control, traction control and other electronic components which are increasingly integrated into braking systems.

Its activities consist of defining a generic specification for components (e.g., integrated circuit (IC) memory circuits, memory modules, logic circuits, linear circuits, microprocessor circuits, peripheral circuits and passive components) which has been recognized as a de facto industry standard throughout the world; certifying compliance with that specification by individual products; defining a standard ('S/0001') for manufacturers of such components; certifying compliance by individual manufacturers with that standard; monitoring prices paid by member companies for such components; and reporting the resulting benchmark prices to ...[+++] them.